The American Society for Engineering Education (ASEE) administers a number of federal scholarship and fellowship programs for undergraduates – including for the Office of Naval Research’s Naval Research Enterprise Internship Program and NASA’s Aeronautics Scholarship Program.
Applications are due December 15, 2014 for the SMART (Science, Math, and Research for Transformation) Scholarship for Service program. See the application instructions HERE.
ASEE also administers engineering scholarship, internship, and fellowship programs for graduate students and postdoctoral researchers.
Finding resources and funding to advance your engineering career and academic pursuits can be pretty daunting. The right one could be anywhere, from corporations, organizations, or institutions. But some other sources worth checking out are U.S. federal agencies. The Department of Agriculture, National Science Foundation, Department of Defense, Office of Naval Research, Department of Energy, and Department of Transportation all provide useful avenues. These include internships, fellowships, contests, career and research opportunities, and general information. For scholarships, see our comprehensive list.
The National Defense Science and Engineering Graduate Fellowship Program (NDSEG), administered by ASEE, is a highly competitive, portable fellowship that is awarded to U.S. citizens and nationals who intend to pursue a doctoral degree in one of fifteen supported disciplines. NDSEG confers high honors upon its recipients and allows them to attend whichever U.S. institution they choose. NDSEG Fellowships last for three years and pay for full tuition and all mandatory fees, a monthly stipend, and up to $1,000 a year in medical insurance.
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The Naval Research Enterprise Intern Program (NREIP), administered by ASEE, provides an opportunity for students to participate in research at a Department of Navy (DoN) laboratory during the summer. The goals of NREIP are to encourage participating students to pursue science and engineering careers, to further education via mentoring by laboratory personnel and their participation in research, and to make them aware of DoN research and technology efforts, which can lead to employment within the DoN.
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The Field-Reversible Thermal Connector (RevCon) Challenge, sponsored by the Defense Advanced Research Projects Agency (DARPA) and the Office of Naval Research (ONR), asks undergraduate and graduate students to develop a novel design concept for a field-reversible, low-resistance thermal connector, which could be used in military electronic modules. The goal is to encourage science, technology, engineering and mathematics (STEM) education and inspire future innovators to consider thermal management techniques and the key role they will play in tomorrow’s electronics.
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