Lockheed Martin Corporation offers the Innovate the Future Contest, a worldwide innovation competition with cash awards totaling $50,000. The contest creates a global forum for interested participants to share their ideas on how innovation can enable a more secure future for the planet. Participants are invited to submit their thoughts on a range of topics facing the world community, including the need for sustainable energy, cyber security, and healthcare.
The Field-Reversible Thermal Connector (RevCon) Challenge, sponsored by the Defense Advanced Research Projects Agency (DARPA) and the Office of Naval Research (ONR), asks undergraduate and graduate students to develop a novel design concept for a field-reversible, low-resistance thermal connector, which could be used in military electronic modules. The goal is to encourage science, technology, engineering and mathematics (STEM) education and inspire future innovators to consider thermal management techniques and the key role they will play in tomorrow’s electronics.